Product Engineer for Chips Company in KL, Malaysia

Job Overview


Responsibility for product engineering for new product development and production of manufacturing

●  Experience in semiconductor IC development, IC manufacturing, fabrication, test, and packaging.

●  Strong project leadership skills to manage external vendors, drive cross functional teams and drive sub-project as part of larger development programs

●  Knowledge of IC development including test development, DFM, IC characterization, failure analysis, qualification, debug, yield analysis, process controls, statistics and fabless supply chain management

●  Knowledge in DFT, silicon fabrication process, package design and development, IC assembly, and product Q&RA.

●  The candidate would benefit from background in various product market area such as high performance compute, automotive, telecom.

●  Good understanding for MEMS, reliability and yield improvement. Work closely with our MEMS team.


B.Sc./M.Sc. in Electrical and Electronic Engineering

●  12+ years of experience in product and test engineering depending education

background and relevant product and market experience

●  Experienced in running cross functional teams

●  Experience in managing vendors/partners

●  Strong probability and statistics background including DOE’s

●  Strong background in characterisation and debug

●  Good understanding of manufacturing test

●  Good understanding of packaging types and design requirements

●  Knowledgeable in DFT and DFM techniques

●  Good software skills, especially in scripting languages

●  Understanding of CMOS device and product reliability

●  Good understanding in quality management, ISO9001, ISO26262

●  Direct experience in IC production

●  Experience in both EFA and PFA

●  Strong presentation and communication skills

Job Detail
Shortlist Never pay anyone for job application test or interview.